Series- Expandable Fanless & Ventless System TPM 2.0 | AMI220
Series- Expandable Fanless & Ventless System TPM 2.0 | AMI220
Series- Expandable Fanless & Ventless System TPM 2.0 | AMI220
Series- Expandable Fanless & Ventless System TPM 2.0 | AMI220
Series- Expandable Fanless & Ventless System TPM 2.0 | AMI220
The AMI220 is an expandable modular fanless system supporting the 7th/6th generation Intel® Core™ i7/i5/i3 desktop processors designed for industrial-grade solutions in smart factory automation and retail applications.
Description
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It is an innovative fanless and cable-free system built with an efficient passive finned heat sink and an industrial-grade motherboard that has a rich I/O interface and a power supply with over-voltage, low voltage and anti-plug protection. The AMI220 comes with modular expansion slots to accommodate diverse PCI-E, PCI or Fieldbus cards, which can be arbitrarily changed to increase system assembly flexibility and create the ideal solution according to customer specification needs.
The rugged AMI220 series is suitable for demanding applications in harsh environments. It has an operating temperature range of -10°C to 50°C with enhanced passive cooling for maximum thermal performance.
FEATURES
Fanless system supports IBASE MB220 customized board
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It is an innovative fanless and cable-free system built with an efficient passive finned heat sink and an industrial-grade motherboard that has a rich I/O interface and a power supply with over-voltage, low voltage and anti-plug protection. The AMI220 comes with modular expansion slots to accommodate diverse PCI-E, PCI or Fieldbus cards, which can be arbitrarily changed to increase system assembly flexibility and create the ideal solution according to customer specification needs.
The rugged AMI220 series is suitable for demanding applications in harsh environments. It has an operating temperature range of -10°C to 50°C with enhanced passive cooling for maximum thermal performance.
FEATURES
Fanless system supports IBASE MB220 customized board